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SMP | Jack - Right Angle | Crimp
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Product Overview
Part Number
MP17-0174-C01
Series
Description
SMP Right Angle Crimp Jack, Gold Plated, RG174, LBC100, RG188, RG316
Primary Fixing
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Specifications
Electrical
Dielectric Withstanding
500 Volts RMS Maximum
Impedance
50 ohms
Interface Frequency
40 GHz
Working Voltage
335 Volts RMS Maximum
Environmental
RoHS Compliant
Yes
Temperature Range
-65 to +165 degrees C
Material
Body
Brass / Beryllium Copper, Gold Plated
Contact
Beryllium Copper, Gold Plated
Dielectric
PTFE
End Cap
Brass, Gold Plated
Ferrule
Brass, Gold Plated
Mechanical
Cable Retention
Equal to breaking strain of cable
Contact Termination
Solder
Durability
When mated with Full Detent: 100 Cycles, Limited Detent: 500 Cycles and Smooth Bore: 1000 Cycles
Fixing Method
Crimp
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Cable Preparation
A = 0.197in
B = 0.083in
C = 0.039in
S1_R
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Tooling
Crimp Die Sizes
0.128in hex.
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Documents
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Order
UK stock 0
Pending 0
Minimum order quantity 1
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Pricing
1 off £8.28 each
10 off £6.62 each
50 off £6.02 each
100 off £5.71 each
300 off £5.44 each
▣
Order
UK stock 0
Pending 0
Minimum order quantity 1
▣
Pricing
1 off £8.28 each
10 off £6.62 each
50 off £6.02 each
100 off £5.71 each
300 off £5.44 each
▣
Product Overview
Part Number
MP17-0174-C01
Series
Description
SMP Right Angle Crimp Jack, Gold Plated, RG174, LBC100, RG188, RG316
Primary Fixing
▣
Specifications
Electrical
Dielectric Withstanding
500 Volts RMS Maximum
Impedance
50 ohms
Interface Frequency
40 GHz
Working Voltage
335 Volts RMS Maximum
Environmental
RoHS Compliant
Yes
Temperature Range
-65 to +165 degrees C
Material
Body
Brass / Beryllium Copper, Gold Plated
Contact
Beryllium Copper, Gold Plated
Dielectric
PTFE
End Cap
Brass, Gold Plated
Ferrule
Brass, Gold Plated
Mechanical
Cable Retention
Equal to breaking strain of cable
Contact Termination
Solder
Durability
When mated with Full Detent: 100 Cycles, Limited Detent: 500 Cycles and Smooth Bore: 1000 Cycles
Fixing Method
Crimp
▣
Cable Preparation
A = 0.197in
B = 0.083in
C = 0.039in
S1_R
▣
Tooling
Crimp Die Sizes
0.128in hex.
▣
Documents